wiping, high normal force contacts. Interconnection to the Board is accomplished with either one or two options.
The ZIF Connector is directly mounted to the board and retained by riveting. Interconnection to the solder plated pads of the board is through a dimpled, limited wipe, high force, bottom contact.
The ZIF connector is directly mounted to the mother board and retained by the solder-tab legs which are soldered to the mating holes in the printed circuit.
Description
The multi-pin ZIF connector features a rigid housing either surface mounted or through-hole mounted to the board. The one piece contacts are automatically stitch loaded through the top of the housing. Each contact is securely locked into position through the action of the locking lance.
A thermoplastic SSR rated material such as Poly-Phenylene-Sulfide, is the basic material for housing and cam members.
Contacts
LOW PROFILE ZIF RECEPTACLE 40 POSITION–1.51
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One piece stamped, formed and dimpled contact interface of beryllium copper.
Heat treated beryllium copper is creep resistance, high in conductivity and stable over wide temperature range.
Features
DIP Leads Wiped and Mated Both Front and Back
Contact designed to mate simultaneously with front and rear sides of DIP legs as cam is activated thus, providing redundant contact interface.
Open Face Housing Design Eliminates Stubbing of DIP Leads.
Generous lead in eliminates stubbing of DIP leads during insertion.
Contact Repairability
Contacts are easily replaced.
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